Publications
BLAST: A Wafer-Scale Transfer Process for Heterogeneous Integration of Optics and Electronics
A general transfer method is presented for the heterogeneous integration of different photonic and electronic materials systems and devices into a single substrate. Called BLAST, for Bond, Lift, Align, and Slide Transfer, the process works at wafer scale and offers precision alignment, high yield, varying topographies, and suitability for subsequent lithographic processing. BLAST's capabilities is demonstrated by integrating both GaAs and GaN µLEDs with silicon photovoltaics to fabricate optical wireless integrated circuits that up-convert photons from the red to the blue.
Nanocalorimetry using microscopic optical wireless integrated circuits
We present in situ calorimetry, thermal conductivity, and thermal diffusivity measurements of materials using temperature-sensing optical wireless integrated circuits (OWiCs). These microscopic and untethered optical sensors eliminate input wires and reduce parasitic effects. Each OWiC has a mass of ∼100 ng, a 100-μm-scale footprint, and a thermal response time of microseconds. We demonstrate that they can measure the thermal properties of nearly any material, from aerogels to metals, on samples as small as 100 ng and over thermal diffusivities covering four orders of magnitude.
Microscopic robots with onboard digital control
Autonomous robots-systems where mechanical actuators are guided through a series of states by information processing units to perform a predesigned function-are expected to revolutionize everything from health care to transportation. Microscopic robots are poised for a similar revolution in fields from medicine to environmental remediation. A key hurdle to developing these microscopic robots is the integration of information systems, particularly electronics fabricated at commercial foundries, with microactuators.
Programming interactions in magnetic handshake materials
The ability to rapidly manufacture building blocks with specific binding interactions is a key aspect of programmable assembly. Recent developments in DNA nanotechnology and colloidal particle synthesis have significantly advanced our ability to create particle sets with programmable interactions, based on DNA or shape complementarity. The increasing miniaturization underlying magnetic storage offers a new path for engineering programmable components for self assembly, by printing magnetic dipole patterns on substrates using nanotechnology.
Cilia metasurfaces for electronically programmable microfluidic manipulation
Cilial pumping is a powerful strategy used by biological organisms to control and manipulate fluids at the microscale. However, despite numerous recent advances in optically, magnetically and electrically driven actuation, development of an engineered cilial platform with the potential for applications has remained difficult to realize1–6. Here we report on active metasurfaces of electronically actuated artificial cilia that can create arbitrary flow patterns in liquids near a surface.
Dissipation-enabled hydrodynamic conductivity in a tunable bandgap semiconductor
Electronic transport in the regime where carrier-carrier collisions are the dominant scattering mechanism has taken on new relevance with the advent of ultraclean two-dimensional materials. Here, we present a combined theoretical and experimental study of ambipolar hydrodynamic transport in bilayer graphene demonstrating that the conductivity is given by the sum of two Drude-like terms that describe relative motion between electrons and holes, and the collective motion of the electron-hole plasma.
Accurate Measurement of the Gap of Graphene/h-BN Moiré Superlattice through Photocurrent Spectroscopy
Monolayer graphene aligned with hexagonal boron nitride (h-BN) develops a gap at the charge neutrality point (CNP). This gap has previously been extensively studied by electrical transport through thermal activation measurements. Here, we report the determination of the gap size at the CNP of graphene/h-BN superlattice through photocurrent spectroscopy study. We demonstrate two distinct measurement approaches to extract the gap size. A maximum of ∼14 meV gap is observed for devices with a twist angle of less than 1°.
Nanoliter-Scale Autonomous Electronics: Advances, Challenges, and Opportunities
While CMOS scaling has long been driven by economic and performance concerns in macroscale systems such as computers and smartphones, it has also been recognized that such physically small electronic components could pave the way to vanishingly small autonomous systems. Originally dubbed 'smart dust', these emerging systems include ultra-small wireless sensors, ID tags, and even robots. Such 'Smart Dust' was envisioned to be smaller than a grain of sand, yet measuring and reporting signals around it while being powered and communicating entirely wirelessly [1], [2]. © 2021 IEEE.
Micrometer-sized electrically programmable shape-memory actuators for low-power microrobotics
Shape-memory actuators allow machines ranging from robots to medical implants to hold their form without continuous power, a feature especially advantageous for situations where these devices are untethered and power is limited. Although previous work has demonstrated shape-memory actuators using polymers, alloys, and ceramics, the need for micrometer-scale electro–shape-memory actuators remains largely unmet, especially ones that can be driven by standard electronics ( 1 volt).
Fabrication of Injectable Micro-Scale Opto- Electronically Transduced Electrodes (MOTEs) for Physiological Monitoring
In vivo, chronic neural recording is critical to understand the nervous system, while a tetherless, miniaturized recording unit can render such recording minimally invasive. We present a tetherless, injectable micro-scale opto-electronically transduced electrode (MOTE) that is ∼ 60μ m × 30μ m × 330μ m, the smallest neural recording unit to date. The MOTE consists of an AlGaAs micro-scale light emitting diode (μ LED) heterogeneously integrated on top of conventional 180nm complementary metal-oxide-semiconductor (CMOS) circuit.