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Stress and silicon nitride: A crack in the universal dissipation of glasses

Cornell Affiliated Author(s)

Author

D.R. Southworth
R.A. Barton
S.S. Verbridge
B. Ilic
A.D. Fefferman
H.G. Craighead
J.M. Parpia

Abstract

High-stress silicon nitride microresonators exhibit a remarkable room temperature Q factor that even exceeds that of single crystal silicon. A study of the temperature dependent variation of the Q of a 255μm×255μ m×30nm thick high-stress Si3N4 membrane reveals that the dissipation Q-1 decreases with lower temperatures and is □ 3 orders of magnitude smaller than the universal behavior. Stress-relieved cantilevers fabricated from the same material show a Q that is more consistent with typical disordered materials. e-beam and x-ray studies of the nitride film's structure reveal characteristics consistent with a disordered state. Thus, it is shown that stress alters the Q-1, violating the universality of dissipation in disordered materials in a self-supporting structure. © 2009 The American Physical Society.

Date Published

Journal

Physical Review Letters

Volume

102

Issue

22

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-66749161998&doi=10.1103%2fPhysRevLett.102.225503&partnerID=40&md5=1ce278c3499165941b784b08ca8acd95

DOI

10.1103/PhysRevLett.102.225503

Group (Lab)

Jeevak Parpia Group

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